On-Demand Webinar

Today’s chips and electronic systems are more complex than ever before. Additionally, market competition is at an all time high, driving the need for designers, CAD teams and foundries to innovate, reduce costs and accelerate schedules. Hybrid cloud computing is positioned to deliver a competitive edge, ultimately driving a new era in the semiconductor industry.

Join this webinar to learn about the benefits of a hybrid cloud approach to empower your team to accelerate time to market and reduce schedule risk. See Rescale’s all new hybrid cloud platform, built to seamlessly transition workloads to the cloud for increased scale and performance, while maintaining the highest level of security and efficiency. Topics include:

  • The benefits of a hybrid cloud approach
  • How Gaon Chips leveraged Rescale to design better products and accelerate time to market (video case study)
  • Rescale’s hybrid cloud platform and optimized workflows
  • Rescale’s Multi-Vendor Semiconductor Design Cloud
  • End-to-End Security and Compliance


Jose Fernandez

Semiconductor and Electronics Partnerships


Jeff Critten

Account Executive

Riaz Liyakath.png
Riaz Liyakata

Solutions Architect